Method for the treatment of steel-hybrid printed circuit boards

Details Method for the treatment of steel-hybrid printed circuit boards Method for the treatment of steel-hybrid printed circuit boards

1992-01-09

1994-05-31

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427180, 427299, 427327, 427444, C23C 2600

Patent

active

053167864

ABSTRACT:
A method of pre-treating steel-hybrid circuit board substrates or carrier plates before the application of coatings that are to be burnt in or fired. In prior art steel-hybrid circuit boards of this type, the burning-in of the coatings in a kiln produces undesirable warping of the circuit boards due to the different coefficients of thermal expansion of the materials employed for the coatings and for the carrier plates, unless relatively thick steel-hybrid circuit board carrier plates are employed. This warping is avoided, while still permitting the use of steel hybrid circuit boards of a lesser thickness, by pre-treating the steel-hybrid circuit board carrier plates to provide same with a mechanical pre-stress causing a defined curvature which compensates for the warping of the circuit board to be expected during burn-in.

REFERENCES:
patent: 3007997 (1961-11-01), Panaviti
patent: 3956528 (1976-05-01), Ugro
S. Timoshenko et al. "Elements of Strength of Materials" 4th ed. Van Nostrand Co. 1962, pp. 197-199, 213.
Patent Abstracts of Japan, vol. 4, No. 119 (C-22)23, Aug. 1990.
Patent Abstracts of Japan, vol. 13, No. 132 (E-736)31, Mar. 1989.
Patent Abstracts of Japan, vol. 12, No. 237 (C-509) 6, Jul. 1988.

Affiliated with

Also associated with

Rating

Method for the treatment of steel-hybrid printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the treatment of steel-hybrid printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the treatment of steel-hybrid printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1626643