Method for the tack-free packaging of a hot-melt pressure sensit

Details Method for the tack-free packaging of a hot-melt pressure sensit Method for the tack-free packaging of a hot-melt pressure sensit

1998-02-17

1999-11-23

Johnson, Linda

Package making

Methods

With contents treating

53450, B65B 6308

Patent

active

059878525

ABSTRACT:
The present invention is directed to a method for the high throughput tack-free packaging of a hot-melt thermoplastic or thermosetting pressure sensitive adhesive composition. The method provides for the conveyorized packaging of a continuous stream of a molten hot-melt adhesive composition in a non-tack thermoplastic film wherein the stream is converted into two or more rows of tack-free packaged hot-melt blocks.

REFERENCES:
patent: 2616232 (1952-11-01), Meyer
patent: 2759308 (1956-08-01), Nawrocki
patent: 3481283 (1969-12-01), Vogt
patent: 3851438 (1974-12-01), Brisman
patent: 5715654 (1998-02-01), Taylor et al.
patent: 5804610 (1998-09-01), Hamer et al.
patent: 5806285 (1998-09-01), Rizzieri
patent: 5819505 (1998-10-01), Fayolle et al.

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