Method for the soldering of semiconductor chips on supports of n

Details Method for the soldering of semiconductor chips on supports of n Method for the soldering of semiconductor chips on supports of n

1983-06-10

1986-10-07

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228220, 228232, 228245, B23K 120, B23K 3528

Patent

active

046154787

ABSTRACT:
After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570.degree. C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.

REFERENCES:
patent: 3132419 (1964-05-01), Takikawa
patent: 3136032 (1964-06-01), Berndsen
patent: 3217401 (1965-11-01), White
patent: 3555669 (1971-01-01), Tarn
patent: 3665590 (1972-05-01), Percival
patent: 3665594 (1972-05-01), Raithel
patent: 3735911 (1973-05-01), Ward
patent: 3744121 (1973-07-01), Nagano
patent: 3883946 (1975-05-01), Dale
patent: 3923609 (1975-12-01), Welch
patent: 4019671 (1977-04-01), Akuerek

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