Method for the soldering of external connection wires to an elec

Details Method for the soldering of external connection wires to an elec Method for the soldering of external connection wires to an elec

1989-07-10

1990-04-10

Godici, Nicholas P.

Metal fusion bonding

Process

With shaping

228179, 2281802, 228255, 228 151, 228 563, B23K 120, B23K 3514

Patent

active

049152866

ABSTRACT:
According to the disclosed method for the soldering of wires of components, at least one wire is stamped to make it lose its symmetry of revolution. The result thereof is one or more impressions. A solder strip is crimped by deformation around the wire to form a solder preform held still by the impressions, which leaves free a surface of the wire. The component to be soldered, held against said surface of the wire, is soldered by reflow process. Application: the soldering of components such as disk ceramic capacitors.

REFERENCES:
patent: 3220098 (1965-11-01), Arbogast
patent: 3333047 (1967-07-01), Geoffroi
patent: 3616981 (1971-11-01), Dieteman et al.
patent: 3760622 (1973-09-01), Mansell
patent: 3886650 (1975-06-01), Cobaugh et al.
patent: 4785988 (1988-11-01), Topel et al.

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