Method for the salvage and restoration of integrated circuits fr

Metal working – Method of mechanical manufacture – Scrap recovering or utilizing

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228191, 228119, B23Q 1700

Patent

active

042702607

ABSTRACT:
Components such as IC's mounted on a substrate such as a PCB are removed from the PCB in a heating apparatus. The heating apparatus has a mounting frame which positions the PCB above an array of infra red heating sources. The method includes the steps of bombarding the PCB with infra red energy which is absorbed and conducted to the solder joints to melt the solder to permit extraction of the components.

REFERENCES:
patent: 3557430 (1971-01-01), Jones
patent: 3684151 (1972-08-01), Burman
patent: 3879836 (1975-04-01), Coffin
patent: 4022370 (1977-05-01), Durney
"Repair of Integrated Circuits", Western Electric Technical Digest No. 3, Jul. 1966, Drexinger, p. 11.
IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. 1970, pp. 1811, 1812, ("Infrared Chip Repair Tool"--Beliveau et al.)

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