Method for the replacement of semiconductor devices

Details Method for the replacement of semiconductor devices Method for the replacement of semiconductor devices

1986-10-23

1989-02-21

Hearn, Brian E.

Fishing, trapping, and vermin destroying

2940208, 29847, 29835, 29853, 29762, 437180, 437008, 437923, 357 80, H01L 2160

Patent

active

048065030

ABSTRACT:
A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.

REFERENCES:
patent: 3969813 (1976-07-01), Minetti et al.
patent: 4012832 (1977-03-01), Crane
patent: 4567643 (1986-02-01), Droguet et al.
Anderson et. al., "Josephson Package Repair", IBM Technical Disclosure Bulletin, vol. 26, No. 12, May 1984 pp. 6244-6245.

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