Method for the removal of thermoset potting compound from the el

Details Method for the removal of thermoset potting compound from the el Method for the removal of thermoset potting compound from the el

1998-09-25

1999-03-09

Snay, Jeffrey

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

134 2218, B08B 308

Patent

active

058794689

ABSTRACT:
A method was developed for the nondestructive removal of thermoset foamed potting material from the electronics package of components in ammunition. The ultimate objective in this effort was to perform a systems technical analysis of the electronic guidance and fuse systems. This was being done in order to determine the electronic components used, the engineering design, functional circuitry, and overall performance of the ammunition.

REFERENCES:
patent: 3706691 (1972-12-01), Duffy et al.
patent: 4699667 (1987-10-01), Walsh
patent: 5154197 (1992-10-01), Auld et al.
patent: 5178788 (1993-01-01), Marquis et al.
patent: 5298081 (1994-03-01), Marquis
patent: 5514300 (1996-05-01), Mlasblom
Tatyrek, A.F., Memorandum Report ARAED-MR-94001, "Method for the Removal of hermoset Potting Compound from the Electronics Package of a Munitions Item", May 1995.

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