Method for the removal of a microscopic sample from a substrate

Details Method for the removal of a microscopic sample from a substrate Method for the removal of a microscopic sample from a substrate

2005-06-27

2008-08-05

Vanore, David A. (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C250S492300

Reexamination Certificate

active

07408178

ABSTRACT:
The invention provides a method for the removal of a microscopic sample1from a substrate2,comprising the steps of:performing a culling process whereby the substrate2is irradiated with a beam4such that the sample is cut out of the substrate, andperforming an adhesion process whereby the sample1is adhered to a probe3,characterized in thatthe cutting process and the adhesion process overlap each other temporally.By simultaneously carrying out the culling process and the adhesion process, a time-saving is realized as compared to a method in which these processes are performed sequentially.

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