Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-11-19
2000-01-04
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156344, 148DIG12, 438455, 438456, B32B 3100
Patent
active
060105917
ABSTRACT:
A method for the releasable bonding of at least two wafers (10, 12), for example of two silicon wafers (silicon discs), or of a silicon wafer and a glass wafer, or of a semiconductor wafer and a cover wafer, by a wafer bonding method in which the surfaces to be brought into contact with one another are at least substantially optically smooth and flat. Prior to bringing the surfaces of the wafers (10, 12) into contact, one or more drops of a liquid are applied to at least one of the surfaces, and the wafer bonding method is carried out at least substantially at room temperature, or at a somewhat higher temperature, or optionally at a somewhat lower temperature. The wafers (10, 12) which are bonded together can easily be separated from one another in that at least the liquid enclosed between the wafers (10, 12), which are bonded to one another, is exposed to a temperature lying substantially above the bonding temperature at which the liquid vaporizes. A wafer structure is also disclosed.
REFERENCES:
patent: 4962879 (1990-10-01), Goesele
patent: 5131968 (1992-07-01), Wells et al.
patent: 5882987 (1999-03-01), Srikrishnan
Gosele, U., et al.: "Self-propagating room-temperature silicon wafer bond in ultrahigh vacuum", Appl Phys. Lett 67 (24) (1995), pp. 3614-3616.
Gosele, U., et al.: "Particle Protection of Semiconductor Surfaces" by U.L. Mittal, Plenum Press, N.Y. (1991) pp. 239-247, reprinted in Suss report, vol. 8, 1994.
Gosele, U., et al.: "History and Future of Silicon Wafer Bonding", Solid State Phenomena, 47 & 48, 33-44 (1995).
Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.
Osele Mark A.
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