Method for the production of window elements which can be...

Details Method for the production of window elements which can be... Method for the production of window elements which can be...

2006-05-25

2008-12-23

Ngo, Ngan (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S064000, C438S065000, C438S068000, C438S114000, C257S680000, C257S681000, C257SE33070, C257SE23127

Reexamination Certificate

active

07468293

ABSTRACT:
In a method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing, the object of the invention is to achieve an improved hermetic sealing between window and housing through increased adherence and homogeneity in the metal coating and to prevent penetration of scattered light and unwanted radiation. Optically transparent, flat substrate material whose size is sufficient for a plurality of window elements is provided on at least one surface with an optical coating from which frame-like portions on a coated surface which enclose optically active surfaces of the window elements are subsequently removed, whereupon a metal coating that is used for producing a solder connection to the housing is applied to the generated portions having no coating, and the window elements are separated from the substrate material. An optical seal between a soldering layer system, which is associated with the metal coating, and the optical coating prevents penetration of unwanted radiation.

REFERENCES:
patent: 5483095 (1996-01-01), Kagawa et al.
patent: 6627814 (2003-09-01), Stark
patent: 2007/0108579 (2007-05-01), Bolken et al.
patent: 102 40 355 (2004-03-01), None
patent: 0 807 839 (1997-11-01), None
patent: 11-211555 (1999-08-01), None
patent: 2001-039528 (2001-02-01), None

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