Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-03-02
1996-04-09
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 60, 156 89, 1563066, 1563096, 427191, 427431, 359838, 359900, B32B 3106, B32B 3112, B32B 3126, G02B 508
Patent
active
055058051
ABSTRACT:
For the production of lightweight reflectors or mirror structures, metallic silicon of sufficient thickness is applied to a CFC or CMC substrate preform structure having the dimensions of the component to be produced by a heat treatment process, in particular at temperatures between 1300.degree. C. and 1600.degree. C. and in a vacuum or in a protective atmosphere. In this way, reflectors or mirror structures are formed directly. It is possible to work at temperatures of 300.degree.-600.degree. C. when the silicon is applied in the form of wafers which are joined to the substrate preform by way a zone of a melt eutectic incorporating a nonferrous metal. Preferably the nonferrous metal is gold.
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Blenninger Ernst
Goedtke Peter
Papenburg Ulrich
Industrieanlagen-Betriebsgesellschaft GmbH
Mayes M. Curtis
Simmons David A.
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