Method for the production of printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

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29846, 427 97, H01K 310

Patent

active

060355271

ABSTRACT:
A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in particular by means of laser-ablation, wherein the recesses and/or through holes correspond to the desired structure of conductive tracks and/or plated through holes; introducing a base layer (6) on one or both sides of the substrate (1); and introducing a conductive material (7) onto the base layer (6) which is catalytic and/or activating relative to the conductive material (7). The base layer (6) is selectively removed from the substrate (1), except in the recesses and/or in the through holes, by means of laser-ablation prior to introduction of the conductive material (7). Processing of the surface of the conductive material, the base layer or of the substrate is no longer necessary.

REFERENCES:
patent: 3042591 (1962-07-01), Cado
patent: 4532152 (1985-07-01), Elarde
patent: 4604799 (1986-08-01), Gurol
patent: 4712297 (1987-12-01), Wolfram
patent: 4870751 (1989-10-01), Antoon
patent: 4882200 (1989-11-01), Yung
patent: 4996391 (1991-02-01), Schmidt
patent: 5168624 (1992-12-01), Shirai
"Excimer Laser Deposition and Patterning of Metal Organic Inks" in : IBM TDB, vol. 34, No. 4B, Sep. 1991, pp. 352-353.
"Anwendung der Laseraktivierung und Lasermetallisierung in der Mikroelektronik" in: Galvanotechnick 81 (1990), No. 10, pp. 3495-3499.

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