Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2011-08-23
2011-08-23
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C257S415000, C257S416000, C257S417000, C257S418000, C257S532000, C438S619000, C438S689000, C438S691000, C438S692000, C438S693000, C430S322000, C430S323000, C430S324000
Reexamination Certificate
active
08003537
ABSTRACT:
A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.
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De Raedt Walter
Ekkels Phillip
Rottenberg Xavier
Tilmans Hendrikus
IMEC
Katholieke Universiteit Leuven
Knobbe Martens Olson & Bear LLP
Richards N Drew
Singal Ankush k
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