Method for the production of material for printed circuits and m

Details Method for the production of material for printed circuits and m Method for the production of material for printed circuits and m

1974-02-27

1976-02-03

Powell, William A.

Coating processes

Applying superposed diverse coating or coating a coated base

Metal coating

156 3, 156155, 156249, 204 38B, 427436, B44D 134, C23F 134, C23F 144

Patent

active

039365484

ABSTRACT:
A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17 .mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17 .mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer. The temporary base may be comprised of an aluminum foil coated with a layer of zinc or an aluminum foil to which has been applied zinc and which has the zinc replaced electrochemically by half or partly, by a layer of a metal which is more electro-positive than the metal zinc. In electroplating a thin, unbroken and unpatterned metallic layer onto the temporary base the electroplating takes place in a solution containing copper, pryophosphate and an acid, the pK-value of which is at least 0.8 at 20.degree.C.

REFERENCES:
patent: 2662831 (1953-12-01), Culverhouse
patent: 3155536 (1964-11-01), Freeman et al.
patent: 3489603 (1970-01-01), Darter et al.
patent: 3600245 (1971-08-01), Gates
patent: 3726771 (1973-04-01), Coll et al.
patent: 3730758 (1973-05-01), Laidman

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