Method for the production of material for printed circuits

Details Method for the production of material for printed circuits Method for the production of material for printed circuits

1975-05-22

1976-11-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

156 7, 156 8, 156 18, 156 22, 156151, 156155, 156233, 156238, 156239, 156241, 156330, 204 13, 204 15, 204 40, 204 43R, C23F 0100, C09J 0506, C25D 0510

Patent

active

039909263

ABSTRACT:
A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17.mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17.mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.

REFERENCES:
patent: 1157619 (1969-07-01), UK
patent: 2680699 (1954-06-01), Rubin
patent: 2721822 (1955-10-01), Pritikin
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3203876 (1965-08-01), Deyrup
patent: 3240684 (1966-03-01), Martin et al.
patent: 3536545 (1970-10-01), Traynor et al.
patent: 3634168 (1972-01-01), Janssen et al.
patent: 3660190 (1972-05-01), Stroszynski
patent: 3672986 (1972-06-01), Schneble, Jr. et al.

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