Method for the production of LED bodies

Details Method for the production of LED bodies Method for the production of LED bodies

2007-04-17

2007-04-17

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S124000, C438S126000, C438S127000, C257SE21502, C264S272170

Reexamination Certificate

active

10497727

ABSTRACT:
The invention relates to a method for producing light-conducting LED bodies by injection molding into a mold of a material that is fusible prior to final solidification. Each LED body comprises at least one light-emitting chip and at least two wire-shaped electrodes that are electrically connected to the chip. The injection mold is evacuated via at least one opening per LED after positioning the electronic parts and closing. The evacuation opening is disposed in the proximity of the electrodes in the bottom area of the LED. The fusible material is injected between the bottom area and the chip or the reflector trough at least approximately parallel to the chip surface and at least approximately normal to a surface embodied by two electrodes, with the center line of the injection stream running between two electrodes. The inventive method for producing light-conducting LED bodies prevents the LED electronics from being damaged during normal performance of the injection molding process.

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International Search Report.

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