Method for the production of heat-resistant structured layers

Details Method for the production of heat-resistant structured layers Method for the production of heat-resistant structured layers

1986-06-24

1989-05-09

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

430284, 430325, 430296, 430945, 522 96, 522 97, 427 531, 427 541, G03C 171

Patent

active

048289485

ABSTRACT:
A cost-efficient method for producing dimensionally precise and high-grade heat-resistent structured layers by applying a single coating of a radiation-sensitive soluble polyether-based photopolymer in the form of a layer or foil on a substrate; irradiating the layer or foil through a negative with actinic light or by guiding a light, electron, laser, or ion beam; removing the nonirradiated layer or foil portions; and subsequent optional annealing, wherein the photopolymer comprises an addition product of an olefin-unsaturated monoisocyanate and a polether having at least one hydroxyl group. The layers provided according to the invention can withstand the thermal and mechanical stresses of dip soldering process, and protect circuit surfaces effectively and durably against moisture and corrosion; they are therefore suitable in particular as solder resist and insulating layers in microconductor technology.

REFERENCES:
patent: 3694415 (1972-09-01), Honda et al.
patent: 3776889 (1973-12-01), Pande
patent: 4228232 (1980-10-01), Rousseau
patent: 4233425 (1980-11-01), Hoffman
patent: 4246391 (1981-01-01), Watson
patent: 4287323 (1981-09-01), Cushman
patent: 4320221 (1982-03-01), Tefertiller et al.
patent: 4436806 (1984-03-01), Rendulic et al.
patent: 4442198 (1984-04-01), Tsao et al.

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