Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Reexamination Certificate
2004-03-02
2009-10-27
Kopec, Mark (Department: 1796)
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
C427S372200, C427S393500, C427S457000, C427S474000, C428S413000, C252S500000, C252S518100
Reexamination Certificate
active
07608306
ABSTRACT:
A process is described for producing mouldings from plastics by coating a moulding on one or more sides with a lacquer system, the lacquer system being composed of a binder or a binder mixture, optionally a solvent or solvent mixture, optionally other additives usual in lacquer systems and optionally a thickener, and use can be made here of polymeric thickeners at from 0 to 20% content and oligomeric thickeners at from 0 to 40% content, in each case based on dry film (components a, c, d, e), from 5 to 500 parts by weight, based on a), of an electrically conductive metal oxide powder with a median primary particle size of from 1 to 80 nm and a percentage degree of aggregation of from 0.01 to 99%, from 5 to 500 parts by weight, based on a), of inert nanoparticles coated [sic] in a manner known per se and the lacquer cured.
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Becker Patrick
Hasskerl Thomas
Katusic Stipan
Neeb Rolf
Seyoum Ghirmay
Evonik Degussa GmbH
Kopec Mark
Nguyen Tri V
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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