Method for the production of an electronic component

Details Method for the production of an electronic component Method for the production of an electronic component

2005-08-16

2005-08-16

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S108000, C438S109000

Reexamination Certificate

active

06929975

ABSTRACT:
Electronic packages are produced as follows. Vias in a support body are closed with a highly viscous screen printing material following application of a first metallizing layer forming a base metallization on the support body and in the lead-throughs for the vias. A low viscosity passivating layer, which has been applied on the entire surface of the top and bottom sides of the support body, is selectively removed from certain areas of the top side. A second metailizing layer forming the final metallization of a low-melting point material is applied to the first metallization layer in the areas from which the passivating layer was removed. Electronic components of the circuit arrangement are applied on the top side of the support body and contacted by a soldering process.

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