Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-09-02
1996-10-15
Engel, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 89, 156257, 156278, 359838, 359900, 427162, 427191, 427205, 427227, 427249, 427585, B32B 3112, B32B 3126
Patent
active
055650520
ABSTRACT:
In order to produce lightweight mirror structures or other reflecting components, preformed silicon elements of sufficient wall thickness are applied to a CFC or CMC substrate structure with the dimensions of the component to be produced, at a temperature in the range 1300.degree. C. and 1600.degree. C. either in vacuum or in a protective atmosphere. In this way a mirror structure or reflector is formed directly. It is possible to work at temperatures in the range of 300.degree. C. to 600.degree. C. when the silicon is applied in the form of a preform such as a wafer, which is joined to the substrate by way of a zone of a melt eutectic incorporating a nonferrous metal, which is preferably gold. The surfaces are subsequently coated.
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Naumann/Schroder: Bauelemente der Optik, 5th edition, p. 64, Hanser Verlag.
SiRA; ESTEC-Contract No. 5976/84/NL/PR; Oct. 1985.
W. Englisch, R. Takke, SPIE, vol. 113, Reflective Optics II, 1989, pp. 190-194.
Blenninger Ernst
Deyerler Michael
Goedtke Peter
Papenburg Ulrich
Daimler-Benz Aerospace AG
Engel James
Industrieanlagen-Betriebsgesellschaft GmbH
Mayes M. Curtis
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