Method for the production of a disk-shaped silicon semiconductor

Details Method for the production of a disk-shaped silicon semiconductor Method for the production of a disk-shaped silicon semiconductor

1979-09-10

1981-03-10

Whitehead, Harold D.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51235, B24B 100

Patent

active

042545900

ABSTRACT:
A method for the production of a disk-shaped silicon semiconductor component with at least two adjoining zones of opposite type conductivity and different doping strengths using a lapping disk which includes the steps of positioning and semi-conductor component adjacent the lapping disk, subjecting the semiconductor disk to a suction pressure on its side opposite the lapping disk so as to be bowed up from an initial lapping plane with a radius of curvature corresponding to a desired angle, lapping the semiconductor disk with the rotating lapping disk and beveling off the bounding surface of the semiconductor disk opposite the plane of a pn-junction separating the two zones.

REFERENCES:
patent: 2241478 (1941-05-01), Remington
patent: 2709324 (1955-05-01), Hull
patent: 3685216 (1972-08-01), Frey
patent: 3693301 (1972-09-01), Lemmitre
patent: 3833230 (1974-09-01), Noll
patent: 3861089 (1975-01-01), England
patent: 3889431 (1975-06-01), Johnson
IEEE Transactions on Electronic Devices, vol. ED-20, No. 4, Apr. 1973, pp. 347-352. _

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