Method for the production of a circuit board element

Details Method for the production of a circuit board element Method for the production of a circuit board element

2005-01-21

2009-06-30

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S611000, C029S612000, C029S825000, C029S846000

Reexamination Certificate

active

07552525

ABSTRACT:
A circuit board element (11) and production thereof are disclosed, whereby a noble metal (16) is applied to a structured conductor layer (13) on a circuit board substrate (12), comprising said conductor layer (13). The conductor layer (13) is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer (16), essentially on all of the structured roughened conductor layer (13), whereupon the noble metal layer surface is given a corresponding roughness (8′).

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