Method for the preparation of silicon carbide fibers

Details Method for the preparation of silicon carbide fibers Method for the preparation of silicon carbide fibers

1983-06-17

1985-01-08

Kaplan, G. L.

Chemistry of inorganic compounds

Silicon or compound thereof

Binary compound

C01B 3136

Patent

active

044926812

ABSTRACT:
The invention provides a novel method for the preparation of silicon carbide fibers capable of being performed at a relatively low temperature and giving fibers of relatively large lengths by the vapor-phase pyrolysis of an organosilicon compound on a substrate. The method comprises contacting an organosilicon compound, which should have no halogen and oxygen atoms directly bonded to the silicon atoms and have preferably at least one hydrogen atom directly bonded to the silicon atom in a molecule, with a finely divided powder of a metal or a compound of a metal, such as copper, silver, vanadium, niobium, tantalum, iron, cobalt, nickel, palladium and platinum, at a temperature of 700.degree. to 1450.degree. C. so that the powder serves simultaneously as a catalyst and nucleus for the growth of the silicon carbide fibers thereon formed by the pyrolysis of the organosilicon compound. When the organosilicon compound is deficient of the carbon content relative to the silicon so that free silicon may be formed by the pyrolysis, admixing of a hydrocarbon to the feed of the organosilicon compound can solve the problem.

REFERENCES:
patent: 3493402 (1970-02-01), Niebylski
patent: 4013503 (1977-03-01), Knippenberg et al.

Affiliated with

Also associated with

Rating

Method for the preparation of silicon carbide fibers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the preparation of silicon carbide fibers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the preparation of silicon carbide fibers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-113074