Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-09-30
1999-10-05
Young, Lee W.
Metal working
Method of mechanical manufacture
Electrical device making
29739, 29740, H05K 332
Patent
active
059605367
ABSTRACT:
Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.
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patent: 5617294 (1997-04-01), Watson et al.
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Komatsu Hiroto
Ogino Tsutomu
Rushing, Jr. Bobby
Shin-Etsu Polymer Co. Ltd.
Young Lee W.
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