Method for the preparation of a hot-melt adhesive interconnector

Details Method for the preparation of a hot-melt adhesive interconnector Method for the preparation of a hot-melt adhesive interconnector

1990-01-09

1991-08-20

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29883, 174117A, 174 88R, 439 66, 439 67, 439 77, 439 91, B32B 3118

Patent

active

050411837

ABSTRACT:
The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets.

REFERENCES:
patent: 3685110 (1972-08-01), Randolph
patent: 3775218 (1973-11-01), Hare et al.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4292261 (1981-09-01), Kotani et al.
patent: 4514247 (1985-04-01), Zola
patent: 4546037 (1985-10-01), King
patent: 4729809 (1988-03-01), Dery et al.
patent: 4731503 (1988-03-01), Kitanishi

Affiliated with

Also associated with

Rating

Method for the preparation of a hot-melt adhesive interconnector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the preparation of a hot-melt adhesive interconnector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the preparation of a hot-melt adhesive interconnector will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1006179