Method for the preparation of a bonding tool

Details Method for the preparation of a bonding tool Method for the preparation of a bonding tool

1989-05-09

1990-06-12

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228248, 228 45, B23K 35368, B23K 3528

Patent

active

049325825

ABSTRACT:
A bonding tool to be employed for preparing semiconductor parts, e.g., IC, comprizing a tool-head made of a super hard material, e.g., a single crystal of diamond, etc., which comes into contact with a workpiece in the use of the bonding tool and a shank to which the tool-head is bonded by brazing with a brazing material is prepared by using a silver solder based brazing composition obtained by adding a fine powder for shrinkage-stress-relieving material, e.g., fine diamond powder, etc., to a conventional silver solder based brazing material to which titanium has been added as the brazing material. The method is advantageous in that bonding tools having improved properties; i.e., high brazing strength, high stability in practical use, low brazing strain, low thermal stress etc., can be prepared in a good yield with preventing a crack in the super hard material used as a tool-head of the bonding tools.

REFERENCES:
patent: 3856480 (1974-12-01), Johnson et al.
patent: 3900153 (1975-08-01), Beerwerth et al.
patent: 4689276 (1987-08-01), Jacquez
patent: 4821819 (1989-04-01), Whysona

Affiliated with

Also associated with

Rating

Method for the preparation of a bonding tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the preparation of a bonding tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the preparation of a bonding tool will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-611294