Method for the plasma-activated reactive deposition of electrica

Details Method for the plasma-activated reactive deposition of electrica Method for the plasma-activated reactive deposition of electrica

1989-01-04

1990-10-23

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 38, 427230, 427237, 427238, 4272552, C23C 1608, C23C 1650, C23C 1656

Patent

active

049650904

ABSTRACT:
Electrically conductive multicomponent material is deposited on a tubular substrate (3) by means of a PCVD method. A plasma (9) is produced between an inner electrode (13) and an outer electrode, one of which is tubular and serves as a substrate. In order to obtain multicomponent material of the desired composition, the composition of the gas phase is changed as a function of time and/or place. In particular when metalorganic starting compounds are used, PCVD of many single layers together with an intermittent, for example, Ar/O.sub.2 plasma intermediate treatment yields an efficient removal of undesired carbon or fluorine from the deposited multicomponent material already during its manufacture.

REFERENCES:
patent: 4713259 (1987-12-01), Gartner et al.

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