Method for the manufacture of silicon oxide layers doped with bo

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

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437236, 437240, 501 54, C23C 1600, B05D 512, C03C 306

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active

047910054

ABSTRACT:
A method for the manufacture of silicon layers containing boron and phosphorus dopants wherein the silicon wafers are positioned in a reaction chamber into which there is introduced, from separate sources, (a) tetraethylorthosilicate as a source of silicon dioxide, (b) trimethylborate as a source of boron, and (c) a phosphorus source. The three reactants are decomposed in the reaction chamber to deposit silicon dioxide doped with boron and phosphorus onto the wafers, the decomposition being carried out at a temperature of at least 600.degree. C. and at a substantially subatmospheric pressure.

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patent: 4557950 (1985-12-01), Foster
Winkle et al., "Improved Atmospheric-Pressure CVD System for . . . Phosphosilicate Glass Thin Films", Solid State Technology, vol. 24, No. 10, Oct. 1981, pp. 123-128.
Article by Kern et al. in RCA Review, vol. 43, Sep. 1982, pp. 423-457.
Article by Smolinsky et al. "Measurements of Temperature Dependent Stress of Silicon Oxide", J. Electrochem. Soc., Apr. 1985, pp. 950-954, vol. 132-4.

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