Etching a substrate: processes – Adhesive or autogenous bonding of two or more...
Patent
1993-10-04
1995-06-06
Dang, Thi
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
216 99, 216 47, B05B 100
Patent
active
054219523
ABSTRACT:
A method for fabricating silicon injection plates is both highly precise and particularly simple. The silicon injection plate is formed by an upper silicon plate having injection holes and a lower silicon plate having a through opening and channels. The lower silicon plate is fabricated by simultaneous, double-sided etching of silicon.
REFERENCES:
patent: 4733823 (1988-03-01), Waggener et al.
patent: 4808260 (1989-02-01), Sickafus et al.
patent: 4863560 (1989-09-01), Hawkins
patent: 5160577 (1992-11-01), Deshpande
Boehringer Alexandra
Buchholz Juergen
Findler Guenther
Jauernig Udo
Muenzel Horst
Dang Thi
Robert & Bosch GmbH
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