Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2007-10-09
2007-10-09
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S041000, C216S065000, C216S067000, C216S074000, C216S075000, C174S250000, C438S382000, C438S689000, C219S121670
Reexamination Certificate
active
11348941
ABSTRACT:
A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
REFERENCES:
patent: 2662957 (1953-12-01), Eisler
patent: 3607389 (1971-09-01), Canegallo et al.
patent: 3680013 (1972-07-01), Pye
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3982045 (1976-09-01), Kukanskis
patent: 4191938 (1980-03-01), Gow, III et al.
patent: 4847114 (1989-07-01), Brasch et al.
patent: 4863758 (1989-09-01), Rhodenizer
patent: 4976990 (1990-12-01), Bach et al.
patent: 4978422 (1990-12-01), Letize et al.
patent: 5032427 (1991-07-01), Kukanskis et al.
patent: 5207867 (1993-05-01), Cordani
patent: 5221418 (1993-06-01), Cordani
patent: 5246817 (1993-09-01), Shipley, Jr.
patent: 5254968 (1993-10-01), Zirnheld
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5296334 (1994-03-01), Castaldi et al.
patent: 5324053 (1994-06-01), Kubota et al.
patent: 5332487 (1994-07-01), Young, Jr. et al.
patent: 5431959 (1995-07-01), Kologe et al.
patent: 5478462 (1995-12-01), Walsh
patent: 5517758 (1996-05-01), Nakamura
patent: 5620612 (1997-04-01), Kukanskis et al.
patent: 5680092 (1997-10-01), Yamada et al.
patent: 5747098 (1998-05-01), Larson
patent: 5935706 (1999-08-01), Hoover et al.
patent: 5945257 (1999-08-01), Doeling
patent: 6047463 (2000-04-01), Ulmer
patent: 6144287 (2000-11-01), Komeda
patent: 6281090 (2001-08-01), Kukanskis et al.
Castaldi Steven
Durso Frank
Fritz Dennis
Kukanskis Peter
Sawoska David
Ahmed Shamim
Carmody & Torrance LLP
LandOfFree
Method for the manufacture of printed circuit boards with... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the manufacture of printed circuit boards with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the manufacture of printed circuit boards with... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3864822