Method for the manufacture of printed circuit boards

Coating processes – Electrical product produced

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427 96, 427 97, 427 98, 427125, 205125, 205126, 216 12, 216 17, 216 92, 216105, B05D 132

Patent

active

054747988

ABSTRACT:
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.

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patent: 5348590 (1994-09-01), Shigemura et al.

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