Method for the manufacture of printed circuit boards

Details Method for the manufacture of printed circuit boards Method for the manufacture of printed circuit boards

1997-11-17

2000-09-19

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156326, 427 98, 427304, 427437, B05D 512

Patent

active

061206393

ABSTRACT:
A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

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