Method for the manufacture of printed circuit boards

Details Method for the manufacture of printed circuit boards Method for the manufacture of printed circuit boards

1996-10-30

1997-12-02

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427282, 205125, 205126, 216 41, 216 44, 216105, B05D 512

Patent

active

056933649

ABSTRACT:
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

REFERENCES:
patent: 3628999 (1971-12-01), Schneble, Jr.
patent: 4608275 (1986-08-01), Kukanskis et al.
patent: 4863758 (1989-09-01), Rhodenizer et al.
patent: 4876117 (1989-10-01), Akahoshi et al.
patent: 4897118 (1990-01-01), Ferrier et al.
patent: 4931148 (1990-06-01), Kukanskis et al.
patent: 4976990 (1990-12-01), Bach et al.
patent: 5032427 (1991-07-01), Kukanskis et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5348590 (1994-09-01), Shigemura et al.
patent: 5362334 (1994-11-01), Adams et al.

Affiliated with

Also associated with

Rating

Method for the manufacture of printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the manufacture of printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the manufacture of printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-799382