Method for the manufacture of multilayer ceramic electronic...

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Particular or specific manner of positioning – arranging – or...

Reexamination Certificate

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C264S656000, C264S671000

Reexamination Certificate

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07128870

ABSTRACT:
A method for manufacturing multilayer ceramic electronic components includes the steps of removing organic materials from multilayer ceramic bodies having internal electrodes and ceramic layers, and then sintering the multilayer ceramic bodies. After finishing the removing step, it is preferable that the amount of the remaining organic materials in the multilayer ceramic body is 0.5 to 8.5 weight %, more preferably 1.0 to 5.0 weight %. The removing process may be performed in a neutral, a reductive or inert atmosphere. It is also preferable that the organic materials removing temperature of the internal electrodes are controlled to be higher than that of the ceramic layer.

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patent: 5406058 (1995-04-01), Lipp
patent: 5419857 (1995-05-01), Van den Sype
patent: 5868884 (1999-02-01), Oiwa et al.
patent: 5997795 (1999-12-01), Danforth et al.
patent: 6004624 (1999-12-01), Bates et al.
patent: 6069103 (2000-05-01), Kwon
patent: 6142774 (2000-11-01), Brands et al.
patent: 6156246 (2000-12-01), Chatterjee et al.
patent: 9-129481 (1997-05-01), None
Machine translation of JP 09-129481 retrieved from http://www19.ipdl.ncipi.go.jp on Apr. 17, 2006.
Korean Office Action dated Dec. 8, 2005 with partial translation.

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