Method for the manufacture of micro solder bumps on copper pads

Details Method for the manufacture of micro solder bumps on copper pads Method for the manufacture of micro solder bumps on copper pads

1997-09-24

2000-04-25

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228118, 22818022, 21912175, B23K 3512, B23K 3102, B23K 120

Patent

active

060533978

ABSTRACT:
Method for the manufacture of micro solder bumps, in which holes are structured by means of laser ablation in a mask, in order to produce solder bumps higher than the mask thickness. Through the additional use of a wobble plate in the production of trough-like stepped holes, micro solder bumps with an even larger volume can be produced.

REFERENCES:
patent: 4328410 (1982-05-01), Slivinsky et al.
patent: 4940881 (1990-07-01), Sheets
patent: 5024372 (1991-06-01), Altman et al.
patent: 5262614 (1993-11-01), Katayama et al.
patent: 5406701 (1995-04-01), Pepe et al.
patent: 5660321 (1997-08-01), Ishida et al.
patent: 5841102 (1998-11-01), Noddin
Patent Abstracts of Japan JP 6112275 Apr. 22, 1994.
Patent Abstracts of Japan JP 63156343 Jun. 29, 1988.
Patent Abstracts of Japan JP 8031979 Feb. 02, 1996.
European Search Report, EP 96 11 8107, Apr. 04, 1997.

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