Method for the manufacture of electronic devices on...

Details Method for the manufacture of electronic devices on... Method for the manufacture of electronic devices on...

2011-06-14

2011-06-14

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21567

Reexamination Certificate

active

07960246

ABSTRACT:
Methods for manufacturing electronic devices and devices produced by those methods are disclosed. One such method includes releasably bonding a first surface of a device substrate to a face of a first carrier substrate using a first bonding agent to produce a first composite substrate, where the face of the first carrier substrate includes a pattern of trenches. The method also includes processing the device substrate to manufacture an electronic device on a second surface of the device substrate. The method further includes releasing the device substrate from the first carrier substrate by a releasing agent.

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