Method for the manufacture of electronic circuits utilizing a co

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29830, 29832, 156327, 428470, 524270, 524394, C09J 510

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active

050592726

ABSTRACT:
A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the metal salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the field of electronic industry.

REFERENCES:
patent: 4135033 (1979-01-01), Lawton
Webster's II New Riverside University Dictionary, p. 1068 (1984).

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