Method for the manufacture of confectionery wafer products

Food or edible material: processes – compositions – and products – Filling cavity in edible solid preform with edible material – Dough type preform

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

426512, A23G 320

Patent

active

049139207

ABSTRACT:
The device is intended for the manufacture of food products made by joining together first and second wafers, in which at least the first wafer includes a substantially flat core portion with a region having a distinct perimeter in which cell parts are provided for receiving a filling. The device comprises a peripheral frame having an end edge for supporting the wafer provided with cell parts in correspondence with said distinct perimeter. A plurality of clamping members associated with the peripheral frame are able to pivot relative to the frame between a closed position in which they extend at least partially to cover the end edge and can clamp the first wafer and/or the two joined wafers on the device, and an open position, in which it allows wafers to be inserted into and removed from the device itself.

REFERENCES:
patent: 1814485 (1931-07-01), Moss
patent: 4421773 (1983-12-01), Akutagawa

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for the manufacture of confectionery wafer products does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the manufacture of confectionery wafer products, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the manufacture of confectionery wafer products will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1356516

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.