Method for the manufacture of a contact-free or hybrid card

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156297, 156300, 235488, 235491, 235492, 257679, 257687, 264138, 264157, 264263, 26427213, 26427215, 26427217, 283 83, 283904, B29C 3910, B32B 3106, B32B 3118, G06K 19077

Patent

active

056907737

ABSTRACT:
A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, a frame is deposited on a lower thermoplastic sheet demarcating the edges of a cavity; the electronic module is positioned at the bottom of the cavity; this cavity is filled with a polymerizable resin; and the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied. The resin polymerizes, and the card is cut out within the frame.

REFERENCES:
patent: 5399847 (1995-03-01), Droz

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