Method for the manufacture and placement of pressure-sensitive c

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156257, 156268, 156540, 156542, B32B 3100

Patent

active

052365352

ABSTRACT:
This invention provides an improved method and apparatus for the manufacture of pressure-sensitive labels or pressure-sensitive composite material components and placement thereof. The invention provides a flexible, high-speed method of accurately severing a specific component from a continuous length of pressure-sensitive label stock or composite material stock and placing the severed component at a precise location on the surface of a product. Accurately positioning a severed component of a pressure-sensitive composite material on a desired surface is achieved by imparting a precise longitudinal forward movement to the feedstock containing the severed component immediately after the component has been severed in a manner that prevents lateral movement of the carrier strip. The severed component is brought into contact with a transport means and rigidly attached to the transport means at a precise location thereon prior to separating any portion of the severed component from the carrier strip. The severed component is then separated from the carrier strip and transported to a precise position with respect to the surface to which it is to be applied. A substantially constant tension is maintained on the carrier strip during the process.

REFERENCES:
patent: 4359358 (1982-11-01), Hattemer
patent: 4469550 (1984-09-01), O'Steen, Jr.
patent: 4479839 (1984-10-01), Tasma
patent: 4612079 (1986-09-01), Ostrow
patent: 4680081 (1987-07-01), Hamisch, Jr.
patent: 4726865 (1988-02-01), Treat
patent: 4849043 (1989-07-01), Instance

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for the manufacture and placement of pressure-sensitive c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for the manufacture and placement of pressure-sensitive c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the manufacture and placement of pressure-sensitive c will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2241158

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.