Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-08-30
2005-08-30
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C438S455000, C438S458000, C438S615000
Reexamination Certificate
active
06936500
ABSTRACT:
A description is given of a method for the lateral contacting of a semiconductor chip in which, in the case of a first semiconductor chip (11), which has an electrical contact (17) in a side face (14), a layer (27) of an adhesive material (2) is applied to an exposed contact area (17a) and a preformed particle (23) of an electrically conductive material which can be made to melt by supplying heat is applied to the layer (27). A second semiconductor chip (12) is placed against the first semiconductor chip (11) in such a way that the particle (23) adhering to the first semiconductor chip (11) touches an electrical contact (18) of the second semiconductor chip, and both the semiconductor chips (11, 12) and the particle are heated until the particle (23) fuses onto the electrical contacts (17, 18) of the first and second semiconductor chips. The method according to the invention makes electrical contacting of semiconductor chips (11, 12) possible via their side faces with the aid of soldering or bonding techniques which can conventionally only be used for horizontally mounted areas to be contacted.
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Ghyka Alexander
Slater & Matsil L.L.P.
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