Method for the interconnection of active and passive...

Details Method for the interconnection of active and passive... Method for the interconnection of active and passive...

2004-06-30

2009-12-22

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S106000, C438S464000, C257SE23001

Reexamination Certificate

active

07635639

ABSTRACT:
A method for interconnecting active and passive components in two or three dimensions, and the resulting thin heterogeneous components. The method comprises: positioning and fixing (11) at least one active component and one passive component on a flat support (23), the terminals being in contact with the support, depositing (12) a polymer layer (24) on all of the support and the components, removing the support (14), redistributing the terminals (15) between the components and/or toward the periphery by metal conductors (26) arranged in a predetermined layout, making it possible to obtain a heterogeneous reconstituted structure, heterogeneously thinning (16) the structure by nonselective surface treatment of the polymer layer and at least one passive component (22).

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