Method for the integrated series-interconnection of thick-film s

Details Method for the integrated series-interconnection of thick-film s Method for the integrated series-interconnection of thick-film s

1989-03-15

1990-08-14

Weisstuch, Aaron

Fishing, trapping, and vermin destroying

437 2, 136244, 136249, 136258, H01L 3118

Patent

active

049487400

ABSTRACT:
A method is provided for the series-interconnection of a plurality of thick-film solar cells. Separating grooves in the thick-film semiconductor layer necessary for forming conductive connections between the cells are produced through a lift-off technique. The stripe pattern needed for the lift-off technique is applied onto a substrate having structured base electrodes. The stripe pattern is applied thereto as a paste in a silk-screening method before the surface-wide deposition of the thick-film semiconductor and is removed before the deposition of the cover electrode layer. Involved mechanical parting methods are avoided through the method of the present invention. According to an embodiment of the present invention, a polycrystalline silicon layer can be used as a thick-film and the solar cell manufactured therewith can be combined via an optional coupler with a solar cell based on amorphous, hydrogenated silicon (a-Si:H), whereby an a-Si:H cell comprising two transparent electrodes can be wired as the front cell. The method is cost-beneficial because it can be easily automated and allows a high throughput.

REFERENCES:
patent: 4243432 (1981-01-01), Jordan et al.
patent: 4313022 (1982-01-01), Jordan et al.
patent: 4847669 (1989-07-01), Yamazaki
Morel et al., Energy-Based Performance and Evaluation of Thin Film Si:H/Copper Indium Diselenide Tandem Solar Cells and Modules, Proceedings of the 18th Photovoltaic Specialists Conference (1985), pp. 876-882.
W. Juergens et al, Economical Patterning of Series Connected a-Silicon Modules, Proceedings of the 7th E.C. Photovoltaic Solar Energy Conference, Oct. 1986, pp. 494-503.

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