Method for the generation of stacking-fault-induced damage on th

Details Method for the generation of stacking-fault-induced damage on th Method for the generation of stacking-fault-induced damage on th

1996-07-09

1998-01-20

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Gettering of substrate

By vibrating or impacting

438690, H01L 2100

Patent

active

057100772

ABSTRACT:
A method for the generation of stacking-fault-induced damage on the back of emiconductor wafers is by treating the back with loose hard-material particles which are suspended in a liquid. The back of the semiconductor wafer is brought into contact with the suspended hard-material particles and the hard-material particles are propelled tangentially to the back, under which circumstances they exert on the back of the semiconductor wafer forces which have essentially only tangentially directed components.

REFERENCES:
patent: 3905162 (1975-09-01), Lawrence et al.
patent: 4144099 (1979-03-01), Edmonds et al.
patent: 4587771 (1986-05-01), Buchner et al.
patent: 5164323 (1992-11-01), Brehm et al.
patent: 5223734 (1993-06-01), Lowrey et al.
patent: 5487697 (1996-01-01), Jensen

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