Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1996-08-05
1997-03-25
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427379, 427387, 427558, 427559, 427595, B29C 7102
Patent
active
056142714
ABSTRACT:
Proposed is an improved method for the formation of a silica-based coating film on the surface of a substrate such as a silicon wafer in the manufacture of semiconductor devices by coating the substrate surface with a polysilazane-containing coating solution followed by conversion of the coating layer of polysilazane into a silica-based coating film. The method comprises drying the coating layer of the polysilazane according to a heating schedule at a specified heating rate with continuous or stepwise increase of the temperature up to 240.degree. to 350.degree. C. followed by an irradiation treatment with far ultraviolet light at a temperature of 240.degree. to 350.degree. C. and then by a baking treatment at 350.degree. to 800.degree. C.
REFERENCES:
patent: 4865649 (1989-09-01), Kashiwagi et al.
Hagiwara Yoshio
Kobari Hideya
Nakayama Toshimasa
Okano Susumu
Shibuya Tatsuhiko
Pianalto Bernard
Tokyo Ohka Kogyo Co. Ltd.
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