Method for the fabrication of printed circuits

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156311, 156312, C09J 506

Patent

active

039606350

ABSTRACT:
With a method for the fabrication of multilayers a laminate is obtained by the stacking of layers, which are formed by a carrier provided with a conductor pattern and interleaved by adhesive layers. The laminate is subjected to a process which is carried out in at least three phases: in the first phase moisture and air are extracted from the space in which the laminate is placed, in the second phase the laminate is pressed together under increasing temperature and in the third phase the pressing process is performed under another temperature rise to a certain maximum value and under a further increase in pressure, while air is admitted into the space where the laminate is situated.

REFERENCES:
patent: 3305416 (1967-02-01), Kahan et al.
patent: 3573126 (1971-03-01), Kougel
patent: 3660199 (1972-03-01), Riccitiello et al.
patent: 3679515 (1972-07-01), Capellet
patent: 3681167 (1972-08-01), Moore
patent: 3681171 (1972-08-01), Hojo et al.
patent: 3852136 (1974-12-01), Plumat et al.

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