Etching a substrate: processes – Forming or treating electrical conductor article – Adhesive or autogenous bonding of self-sustaining preforms
Patent
1995-11-21
1997-05-20
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Adhesive or autogenous bonding of self-sustaining preforms
216 33, 216 35, 216 41, B44C 122, C23F 100
Patent
active
056309481
ABSTRACT:
Integrated conductor suspensions are fabricated by progressively etching a suspension shape in a preformed laminate of copper, and stainless steel adhering to an intermediate resin layer, including defining pairs of signal lines in the copper layer having exposed sides and top, and coating these exposed sides and top with an adherent layer of gold down to the resin layer against corrosion in ambient corrosive environments.
REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 3841905 (1974-10-01), Dixon
patent: 4606788 (1986-08-01), Moran
patent: 5039570 (1991-08-01), Sturm
Ueda Susumu
Vera Daniel
Bachand Louis J.
Magnecomp Corp.
Powell William
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