Method for the fabrication of devices including polymeric materi

Details Method for the fabrication of devices including polymeric materi Method for the fabrication of devices including polymeric materi

1977-11-17

1980-05-20

Smith, Ronald H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29584, 29588, 156305, 313512, 357 17, 357 73, 427 53, 427 54, 427 74, 427 82, 427 86, 427163, 427386, 428913, B29C 1902, B05D 306, B05D 512

Patent

active

042037921

ABSTRACT:
The disclosed device fabrication method makes use of a multicomponent polymer material comprising a mixture of radiation curable material and thermally curable material. The multicomponent polymer is dispensed onto a substrate and irradiated with actinic radiation. A heat cure is then performed. This method provides an initial gelling of the multicomponent polymer material so that the desired shape of the dispensed material may be retained while the heat cure is performed. This method has been applied successfully to a class of opto-electronic devices known as opto-isolators or optically coupled isolators.

REFERENCES:
patent: 3492157 (1970-01-01), Shintard et al.
patent: 3772062 (1973-11-01), Shur et al.
patent: 3776729 (1973-12-01), Levy
patent: 3931354 (1976-01-01), Sheppard et al.
patent: 3935330 (1976-01-01), Smith et al.
patent: 3939488 (1976-02-01), Wakashima et al.
patent: 4025407 (1977-05-01), Chang et al.
Thompson, et al., "Lithography and Radiation Chemistry of Epoxy Containing Negative Electron Resist.," Polymer Eng. and Science vol. 14, No. 7, pp. 529-533 (1974).
Jayson et al., "Coupling Circuits with Light.," Bell Laboratories Record, pp. 20-25 (Jan. 1976).

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