Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Surface finishing
Patent
1989-06-15
1991-03-26
Woo, Jay H.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Surface finishing
264257, B29C 4318
Patent
active
050027158
ABSTRACT:
A method for the fabrication of a heat transfer member for use with electronic or microwave systems is described. The thermal heat transfer member is a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The method involves molding epoxy matrix material along with conductive graphite fibers and filler material in predetermined geometries. The molded member is then formed in a manner such that the fiber ends are cleanly exposed at the surface of the member in predetermined locations. Metal caps may be formed over the fiber ends to improve heat transfer. Heat is transferred into the member, along the commonly directed fibers, then out of the member at a heat output surface.
REFERENCES:
patent: 4256525 (1981-03-01), Allen
patent: 4402779 (1983-09-01), Levy
patent: 4532169 (1985-07-01), Carley
patent: 4554204 (1985-11-01), Ono
patent: 4636344 (1987-01-01), McDougall
patent: 4658071 (1987-04-01), Woltron
patent: 4778638 (1988-10-01), White
patent: 4789416 (1988-12-01), Ford
Fertig Timothy M.
Grapes Thomas F.
Schroeder Mark S.
Durkin II Jeremiah F.
Stucliff W. G.
Westinghouse Electric Corp.
Woo Jay H.
LandOfFree
Method for the fabrication of a heat transfer member for electro does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the fabrication of a heat transfer member for electro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the fabrication of a heat transfer member for electro will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-615787