Chemistry: analytical and immunological testing – Process or composition for determination of physical state...
Patent
1981-12-04
1983-10-11
Bernstein, Hiram H.
Chemistry: analytical and immunological testing
Process or composition for determination of physical state...
436164, 228104, B23K 100
Patent
active
044093330
ABSTRACT:
A test procedure is disclosed for evaluating the solderability properties of molten solder. In the method of this invention, a testpiece is provided which has a transparent support with a film of metal such as copper deposited on one surface of the transparent support. The surface having the metal film is immersed in the molten solder and the time required for alloying to occur and be observed through the transparent support is measured to determine rate of alloying and, thereby, the solderability properties of the molten solder under evaluation.
REFERENCES:
patent: 3753652 (1973-08-01), Gassmann et al.
Herdzik et al., IBM Technical Disclosure Bulletin, vol. 18, No. 10, 3/76, p. 3231.
Harada Shigeo
Tosima Soitiro
Bernstein Hiram H.
Morris Birgit E.
RCA Corporation
Sites Edward J.
LandOfFree
Method for the evaluation of solderability does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the evaluation of solderability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the evaluation of solderability will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1275959