Method for the evaluation of solderability

Details Method for the evaluation of solderability Method for the evaluation of solderability

1981-12-04

1983-10-11

Bernstein, Hiram H.

Chemistry: analytical and immunological testing

Process or composition for determination of physical state...

436164, 228104, B23K 100

Patent

active

044093330

ABSTRACT:
A test procedure is disclosed for evaluating the solderability properties of molten solder. In the method of this invention, a testpiece is provided which has a transparent support with a film of metal such as copper deposited on one surface of the transparent support. The surface having the metal film is immersed in the molten solder and the time required for alloying to occur and be observed through the transparent support is measured to determine rate of alloying and, thereby, the solderability properties of the molten solder under evaluation.

REFERENCES:
patent: 3753652 (1973-08-01), Gassmann et al.
Herdzik et al., IBM Technical Disclosure Bulletin, vol. 18, No. 10, 3/76, p. 3231.

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